This inventor holds 3 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2017-2019.
Company Filing History:
Years Active: 2017-2019
Title: Teong Keat Beh: Innovator in Computing Technology
Introduction
Teong Keat Beh is a notable inventor based in Bayan Lepas, Malaysia. He has made significant contributions to the field of computing technology, holding a total of 3 patents. His work focuses on enhancing system performance and modularization in computing devices.
Latest Patents
Teong's latest patents include an "Apparatus utilizing computer on package construction." This invention is directed towards an apparatus that incorporates a computer on package construction. It features a substrate with one or more semiconductor devices, including a central processing unit (CPU), and additional components installed on the substrate, excluding I/O components. Another significant patent is the "Universal scalable system: on-the-fly system performance conversion via PC-on-a-card and USB for smart devices and IoT enabling." This patent introduces a universal interconnection scheme that allows for modularization of system architecture with a hot-pluggable external computing module, enhancing the performance of various devices, from portable tablets to high-performance PCs.
Career Highlights
Teong Keat Beh is currently employed at Intel Corporation, where he continues to innovate and develop cutting-edge technologies. His work at Intel has positioned him as a key player in the advancement of computing systems.
Collaborations
Teong has collaborated with notable coworkers, including Jackson Chung Peng Kong and Eng Huat Goh, contributing to various projects and innovations within the company.
Conclusion
Teong Keat Beh's contributions to computing technology through his patents and work at Intel Corporation highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of smart devices and computing systems.