Shenzhen, China

Tengfei Leng

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Honor Device Co., Ltd.. Active years: 2026.


 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Tengfei Leng

Introduction

Tengfei Leng is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of stylus technology, showcasing his expertise through his innovative patent. His work reflects a deep understanding of electronic device assembly and user interaction.

Latest Patents

Tengfei Leng holds a patent for a "Stylus and electronic device assembly." This application relates to the stylus field and provides a stylus and an electronic device assembly. The stylus includes a main circuit board, a pressure sensing module, and a first flexible printed circuit. The main circuit board includes a pressure sensing chip, while the pressure sensing module contains a pressure strain collection element. One end of the first flexible printed circuit is electrically connected to the pressure strain collection element, and the other end connects to the main circuit board for communication between the pressure sensing chip and the pressure strain collection element. The stylus is further configured to transmit a first coded signal and a second coded signal, with the second coded signal being transmitted by a second flexible printed circuit.

Career Highlights

Tengfei Leng has worked with Honor Device Co., Ltd., where he has contributed to the development of innovative electronic devices. His experience in this company has allowed him to refine his skills and apply his inventive ideas in practical applications.

Collaborations

Tengfei Leng has collaborated with Hao Wang, further enhancing his work in the field of technology and innovation.

Conclusion

Tengfei Leng is a remarkable inventor whose contributions to stylus technology demonstrate his innovative spirit and technical expertise. His patent reflects a significant advancement in electronic device assembly, showcasing his ability to merge creativity with functionality.

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