Shenzhen, China

Honor Device Co., Ltd.


USPTO Granted Patents = 284


Forward Citations = 0

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710 inventors (with patents filed for the assignee):

goldMedal Yaolei Zhang (10 out of 10 patents)

silverMedal Tao Shao (8 out of 33 patents)

bronzeMedal Jie Yi (8 out of 35 patents)

4.  Haifei Li (8 out of 20 patents)

5.  Jirun Xu (8 out of 15 patents)

6.  Bin Xiao (7 out of 20 patents)

7.  Wei Zhang (7 out of 144 patents)

8.  Yu Wang (7 out of 127 patents)

9.  Shiyu Zhu (7 out of 13 patents)

10.  Bin Yan (7 out of 7 patents)

11.  Congchao Zhu (7 out of 7 patents)

12.  Jiazi Chen (6 out of 9 patents)

13.  Lei Feng (5 out of 62 patents)

14.  Danhong Li (5 out of 21 patents)

15.  Yin Meng (5 out of 6 patents)


Core Competencies:
Hinge Assembly
Foldable Electronic Device
Display Method
Camera Switching
Image Processing
Network Acceleration
Power Management
Touch Scanning
Data Transmission
Sound Signal Processing
User Privacy Protection
Antenna Configuration

284 patents:

Company Overview
Honor Device Co., Ltd., based in Shenzhen, China, specializes in the development and manufacturing of innovative foldable electronics. The company focuses on advanced technologies such as hinge assembly and display methods, enabling the creation of versatile and user-friendly devices. Honor also emphasizes enhancements in camera switching, image processing, network acceleration, power management, and touch scanning, positioning itself as a key player in the evolving landscape of mobile technology.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 13 2026

284 Patents

#26 in Shenzhen

#130 in China

#3,125 in the World

Shenzhen, CN
Shenzhen, China
Forward Citations = 0

710 inventors:

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Honor Device Co., Ltd.. Retrieved from https://idiyas.com/company/honor-device

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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