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For the Inventor, By the Inventor

Shenzhen, China

Honor Device Co., Ltd.

Calculating rank
USPTO Granted Patents = 319


Forward Citations = 12

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738 inventors (with patents filed for the assignee):

goldMedal Jie Yi (10 out of 38 patents)

silverMedal Yaolei Zhang (10 out of 10 patents)

bronzeMedal Tao Shao (8 out of 33 patents)

4.  Wei Zhang (8 out of 146 patents)

5.  Haifei Li (8 out of 20 patents)

6.  Jirun Xu (8 out of 15 patents)

7.  Congchao Zhu (7 out of 38 patents)

8.  Bin Xiao (7 out of 20 patents)

9.  Yu Wang (7 out of 127 patents)

10.  Shiyu Zhu (7 out of 13 patents)

11.  Bin Yan (7 out of 7 patents)

12.  Danhong Li (6 out of 22 patents)

13.  Jiazi Chen (6 out of 9 patents)

14.  Yufei Huang (6 out of 9 patents)

15.  Lei Feng (5 out of 62 patents)


Core Competencies:
Hinge Assembly
Foldable Electronic Device
Display Method
Camera Switching
Image Processing
Network Acceleration
Power Management
Touch Scanning
Data Transmission
Sound Signal Processing
User Privacy Protection
Antenna Configuration

319 patents:

1. D1156349 - Mobile phone (2026-11-03),
2. 12786884 - Bluetooth connection method and device (2026-11-03),
3. 12786826 - Cell reselection method and terminal device (2026-11-03),
4. 12786688 - Data transmission method and terminal device (2026-11-03),
5. 12786632 - Audio processing method and electronic device (2026-11-03),
6. 12786300 - Terminal device (2026-11-03),
7. 12786297 - Display control method and apparatus (2026-11-03),
8. 12785528 - Vibration motor and terminal device (2026-11-03),
9. 12785230 - Battery and electronic device (2026-11-03),
10. 12783634 - Application handoff method and terminal device (2026-11-03),
11. 12783107 - Interface display method and electronic device (2026-11-03),
12. 12783103 - Device connection establishment method and terminal device (2026-11-03),
13. 12783101 - Application clone-based interface display method and related apparatus (2026-11-03),
14. 12778505 - Electronic device and bioelectrical signal acquisition method (2026-11-03),
15. 12777621 - Electronic device comprising recess in buffer component for removing heat generated by electronic components (2026-10-27),
Company Overview
Honor Device Co., Ltd., based in Shenzhen, China, specializes in the development and manufacturing of innovative foldable electronics. The company focuses on advanced technologies such as hinge assembly and display methods, enabling the creation of versatile and user-friendly devices. Honor also emphasizes enhancements in camera switching, image processing, network acceleration, power management, and touch scanning, positioning itself as a key player in the evolving landscape of mobile technology.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Nov 3 2026

319 Patents

#23 in Shenzhen

#115 in China

#2,821 in the World

Shenzhen, CN
Shenzhen, China

Honor Device Co., Ltd.

Forward Citations = 12

738 inventors:

goldMedal Jie Yi (10 out of 38 patents)

silverMedal Yaolei Zhang (10 out of 10 patents)

bronzeMedal Tao Shao (8 out of 33 patents)

4.  Wei Zhang (8 out of 146 patents)

5.  Haifei Li (8 out of 20 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Honor Device Co., Ltd.. Retrieved from https://idiyas.com/company/honor-device

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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