This inventor holds 1 USPTO granted patent. Top assignee: Other. Active years: 2002.
Company Filing History:
1 out of 834,453 Years Active: 2002
Title: Teikou Odashima: Innovator in Semiconductor Technology
Introduction
Teikou Odashima is a notable inventor based in Kawasaki, Japan. He has made significant contributions to the field of semiconductor technology, particularly through his innovative methods of resin sealing.
Latest Patents
Odashima holds a patent for a method of resin sealing a gap between a semiconductor chip and a substrate. This method involves applying a predetermined amount of resin around the semiconductor chip while maintaining a space between the resin and the chip's side face. The process includes reducing atmospheric pressure to exhaust air from the gap, lowering the viscosity of the resin to partially fill the gap, and then pressurizing the atmosphere to completely fill the gap with resin. This technique ensures stable air exhaustion and minimizes resin spattering on the chip.
Career Highlights
Throughout his career, Teikou Odashima has demonstrated a commitment to advancing semiconductor technology. His innovative approach to resin sealing has the potential to enhance the reliability and performance of semiconductor devices.
Collaborations
Odashima has worked alongside talented colleagues, including Takaki Kuno and Hirotaka Okamoto. Their collaborative efforts have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Teikou Odashima's contributions to semiconductor technology through his innovative resin sealing method highlight his role as a key inventor in this field. His work continues to influence advancements in semiconductor manufacturing.