Other

Teikou Odashima

Shoji Yamamoto

Hirotaka Okamoto

Takaki Kuno

A resin sealing method for sealing a gap between a substrate and a semiconductor chip mounted thereon includes the following steps: applying a predetermined amount of resin at and along the circumference of the semiconductor chip in such a manner so as to maintain a space between the resin and a side face of the semiconductor chip; reducing the pressure of the atmosphere around the substrate to exhaust air from the gap; reducing the viscosity of the applied resin to partially fill the gap with resin, thereby leaving a closed cavity reduced in pressure; pressurizing the atmosphere around the substrate to compress the closed cavity due to the pressure difference from the surrounding atmosphere to entirely fill the gap with resin. The exhausting of the air is very stable, and a concentration of resin at the corner of the semiconductor chip can be suppressed, thereby avoiding the spattering of resin onto the top of the chip.

Growing community of inventors

Kawasaki, Japan

Teikou Odashima