Te-Hsun Pang

Title: Te-Hsun Pang: Innovator in Plasma Technology

Introduction

Te-Hsun Pang is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of plasma technology, particularly in the treatment of wafers during fabrication processes. His innovative approach has led to the development of a unique apparatus that enhances the efficiency and safety of wafer treatment.

Latest Patents

Te-Hsun Pang holds a patent for a "Plasma chamber with erosion resistive securement screws." This apparatus is designed to treat a wafer under fabrication with an erosive plasma in a contamination-controlled environment. The chamber contains the wafer and isolates it from external contaminants during treatment. A key feature of this invention is the inclusion of plasma erosion resistive screws, which have a shaft secured within the chamber, ensuring it remains unexposed to the plasma. The raised head of each screw is integral with the shaft and made from the same material, designed to minimize charge accumulation and resist erosion by the plasma. Te-Hsun Pang has 1 patent to his name.

Career Highlights

Throughout his career, Te-Hsun Pang has demonstrated a commitment to advancing technology in the semiconductor industry. His work has not only contributed to the efficiency of wafer fabrication but has also addressed critical issues related to contamination and erosion in plasma treatment processes.

Collaborations

Te-Hsun Pang has collaborated with notable colleagues, including Ray C Lee and Tonny Shu. These partnerships have fostered an environment of innovation and have led to further advancements in their respective fields.

Conclusion

Te-Hsun Pang's contributions to plasma technology exemplify the impact of innovative thinking in the semiconductor industry. His patent for a plasma chamber with erosion resistive screws showcases his dedication to improving wafer treatment processes. Through his work, he continues to influence the future of technology in this critical area.