Te-Hsi Lee

Title: Te-Hsi Lee: Innovator in MEMS and Integrated Circuit Technologies

Introduction

Te-Hsi Lee is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the fields of microelectromechanical systems (MEMS) and integrated circuit technologies. With a total of 2 patents, his work has advanced the capabilities of electronic devices.

Latest Patents

Te-Hsi Lee's latest patents include an "Electrical bypass structure for MEMS device." This invention discloses an apparatus that includes a bypass structure for complementary metal-oxide-semiconductor (CMOS) and/or MEMS devices. The exemplary apparatus consists of a first substrate, a second substrate containing a MEMS device, and an insulator between the two substrates. The electrical bypass structure is designed to be electrically isolated from the MEMS device and any device included in the first substrate.

Another notable patent is the "Method and apparatus for cooling an integrated circuit." This invention describes an integrated circuit that features a heat transfer structure with a chamber containing a fluid. The fluid absorbs heat from the heat-generating portion and changes phases, allowing for efficient heat management within the integrated circuit.

Career Highlights

Te-Hsi Lee is currently employed at Taiwan Semiconductor Manufacturing Company Limited, where he continues to innovate in semiconductor technologies. His work has been instrumental in enhancing the performance and efficiency of electronic devices.

Collaborations

Te-Hsi Lee has collaborated with notable colleagues, including Chia-Ming Hung and Hung-Sen Wang. Their combined expertise has contributed to the successful development of advanced technologies in their field.

Conclusion

Te-Hsi Lee's contributions to MEMS and integrated circuit technologies demonstrate his commitment to innovation. His patents reflect a deep understanding of electronic systems and their applications. Through his work, he continues to influence the future of technology.