Company Filing History:
Years Active: 2020
Title: Te-Chun Wang: Innovator in Chemical Mechanical Polishing Technology
Introduction
Te-Chun Wang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of chemical mechanical polishing (CMP) technology. His innovative work has led to advancements that enhance the quality and efficiency of semiconductor wafers.
Latest Patents
Te-Chun Wang holds a patent for a chemical mechanical polishing pad. This invention provides methods for CMP polishing a metal surface, such as copper or tungsten, in semiconductor wafers. The methods involve using a CMP polishing pad with a top polishing surface that is a reaction product of an isocyanate-terminated urethane prepolymer and a curative component. This innovative polishing layer is designed to achieve coplanar metal and dielectric or oxide layer surfaces with low defectivity and minimized dishing.
Career Highlights
Te-Chun Wang is associated with Rohm and Haas Electronic Materials CMP Holdings, Inc. His work at this company has allowed him to focus on developing advanced materials and processes that are crucial for the semiconductor industry. His expertise in CMP technology has positioned him as a key player in this field.
Collaborations
Te-Chun Wang has collaborated with notable colleagues, including Bainian Qian and Fengji Yeh. These collaborations have fostered an environment of innovation and have contributed to the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Te-Chun Wang's contributions to chemical mechanical polishing technology have made a significant impact on the semiconductor industry. His innovative patent and collaborative efforts highlight his role as a leading inventor in this critical field.