Company Filing History:
Years Active: 2015
Title: Te-Chia Hsu: Innovator in CMP Process Technology
Introduction
Te-Chia Hsu is a notable inventor based in Zhubei, Taiwan. He has made significant contributions to the field of chemical mechanical polishing (CMP) through his innovative patent. His work focuses on enhancing the efficiency and effectiveness of slurry distribution systems used in CMP processes.
Latest Patents
Te-Chia Hsu holds a patent for a "Slurry supply system for CMP process." This patent describes a slurry distribution system that includes a distribution tube connecting a mixing tank to a CMP tool. The mixing tank is designed to create a polishing mixture that consists of a diluted slurry containing abrasive particles. These particles are essential for the mechanical polishing of a workpiece. The polishing mixture is transported via transport piping, and an energy source is integrated with the piping to ensure that the abrasive particles remain suspended, preventing their accumulation.
Career Highlights
Te-Chia Hsu is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading player in the semiconductor industry. His work at this prestigious company has allowed him to contribute to advancements in semiconductor manufacturing processes.
Collaborations
Te-Chia has collaborated with notable colleagues, including Sheng-Chen Wang and Feng-Inn Wu. Their teamwork has fostered innovation and development in CMP technologies.
Conclusion
Te-Chia Hsu's contributions to CMP process technology through his patent demonstrate his commitment to innovation in the semiconductor field. His work continues to influence the efficiency of manufacturing processes, showcasing the importance of inventive solutions in technology.