Te-Chi Wong

Title: Te-Chi Wong: Innovator in Semiconductor Packaging

Introduction

Te-Chi Wong is an inventor based in Hsinchu City, Taiwan. He is known for his contributions to the field of semiconductor packaging. Although he currently holds no granted patents, his innovative ideas are reflected in his latest patent applications.

Latest Patent Applications

Te-Chi Wong has recently filed two notable patent applications. The first application is for a semiconductor package and fabrication method. This semiconductor package includes a package substrate, an interposer, a central logic die, and peripheral function dies. Additionally, it features at least one dummy die positioned between the central logic die and the peripheral function dies, forming a rectangular die arrangement. An underfill material fills the gap between the interposer and the package substrate, while a stress-reducing buffer structure is placed on the bottom surface of the interposer.

The second application is for a flip-chip package and fabrication method. This flip-chip package consists of a substrate with a bond pad in a die-mounting area. A DRAM die is mounted on the substrate in a flip-chip configuration, featuring an input/output (I/O) pad that is electrically connected to the bond pad through a connecting element. Notably, the bond pad has a smaller diameter than the I/O pad. Furthermore, a System on Chip (SoC) die is also mounted on the substrate in a side-by-side manner with the DRAM die.

Conclusion

Te-Chi Wong is an innovative inventor whose recent patent applications demonstrate his expertise in semiconductor packaging. His work has the potential to influence the future of this technology significantly.