Hsinchu, Taiwan

Te-Cheng Yang

This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Te-Cheng Yang. Retrieved from https://idiyas.com/inventor/te-cheng-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: Te-Cheng Yang: Innovator in Electronic Component Cleaning Technology

Introduction

Te-Cheng Yang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic component cleaning technology. His innovative approach has led to the development of a unique cleaning apparatus that enhances efficiency in the industry.

Latest Patents

Te-Cheng Yang holds a patent for a "Tray cleaning apparatus for electronic components." This invention features a top plate, a bottom plate, and two bearing plate assemblies. The first bearing plate assembly includes a first supporting plate with designated disposing areas for blocks, while the second bearing plate assembly comprises a second supporting plate with its own disposing areas. This design allows for effective cleaning of electronic components, ensuring they are maintained in optimal condition.

Career Highlights

Te-Cheng Yang is associated with Chipbond Technology Corporation, where he applies his expertise in developing innovative solutions for electronic components. His work has been instrumental in advancing cleaning technologies within the industry.

Collaborations

Te-Cheng Yang collaborates with talented individuals such as Huan-Kuen Chen and Wen-I Hsieh, who contribute to the innovative environment at Chipbond Technology Corporation.

Conclusion

Te-Cheng Yang's contributions to electronic component cleaning technology exemplify his commitment to innovation. His patent and work at Chipbond Technology Corporation highlight his role as a key inventor in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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