Tay Liang Chee

Title: Inventor Tay Liang Chee: Pioneering Innovations in Semiconductor Packaging

Introduction

Tay Liang Chee is a prominent inventor based in Singapore, known for his significant contributions to semiconductor technology. With a total of four patents to his name, he has made notable advancements in the field of semiconductor packaging, showcasing his ingenuity and technical expertise.

Latest Patents

One of Tay's latest patents involves underfill applications using film technology. This method and apparatus are designed for assembling semiconductor packages efficiently. The invention employs a thin release film that is placed over package components in a mold cavity. By drawing down the release film over the assembled components, it creates an airtight seal around at least three sides, enhancing the flow of encapsulant into the empty spaces between those components. The process utilizes vacuum or air pressure at the airtight seal to facilitate the flow of a mold compound into the empty space. Once the encapsulant fills the cavity, the release film is removed, allowing for effective encapsulation.

Another innovative contribution from Tay is a method for manufacturing prepackaged molding compound for components. This invention involves a prepackaged mold compound utilized in encapsulating integrated circuit die and leadframe assemblies. The process begins with placing a piece of mold compound in a receptacle connected to die cavities. Leadframe strip assemblies are then positioned so that the integrated circuit dies align with the die cavities. A top mold chase is applied, and the prepackaged mold compound is forced through sealed edges during the molding process. The application of pressure through a plunger allows for controlled filling of the cavities, thereby reducing the risk of voids and minimizing wire sweep in the completed packages.

Career Highlights

Throughout his career, Tay Liang Chee has worked with leading technology companies, including Texas Instruments Corporation and Micron Technology Incorporated. His experience in these organizations has undoubtedly contributed to his expertise and the innovative nature of his patented inventions.

Collaborations

Tay's inventive journey has also involved collaborations with esteemed colleagues, such as Mario A Bolanos and Jeremias L Libres. These partnerships have likely fueled creativity and led to significant advancements in their shared field of semiconductor technology.

Conclusion

Tay Liang Chee's work exemplifies the spirit of innovation in the semiconductor industry. With his four patents highlighting groundbreaking inventions in packaging technology, Tay continues to inspire future inventors and contribute to the evolution of semiconductor manufacturing. His contributions not only enhance the efficiency of production processes but also set a foundation for future advancements in the industry.