Takasaki, Japan

Tatsuya Masuda

This inventor holds 1 USPTO granted patent. Top assignee: Shin-Etsu Handotai, Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuya Masuda. Retrieved from https://idiyas.com/inventor/tatsuya-masuda-udjbjsr4

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Tatsuya Masuda: Innovator in Debris Determination Technology

Introduction

Tatsuya Masuda is a notable inventor based in Takasaki, Japan. He has made significant contributions to the field of image processing and inspection technology. His innovative work focuses on improving the reliability of debris detection in manufacturing processes.

Latest Patents

Masuda holds a patent for a debris determination method. This method involves determining debris that occurs around a hard laser mark (HLM) on the backside of a wafer. The process includes several steps: calculating reference luminance from a grayscale image, extracting the printed region that includes the HLM, excluding the dot portion of the HLM, and finally determining the presence or absence of debris based on the extracted debris region. This method provides a reliable means of detecting debris that traditional shape measuring devices may overlook.

Career Highlights

Tatsuya Masuda is currently employed at Shin-Etsu Handotai, Ltd., where he continues to develop innovative solutions in the semiconductor industry. His work has been instrumental in enhancing the quality control processes within the company.

Collaborations

Masuda collaborates with Tomohiro Saito, a fellow innovator in the field. Their combined expertise contributes to advancements in technology and manufacturing processes.

Conclusion

Tatsuya Masuda's contributions to debris determination technology exemplify the importance of innovation in the semiconductor industry. His patent reflects a commitment to improving manufacturing reliability and efficiency.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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