Tokyo, Japan

Tatsuya Hirata

USPTO Granted Patents = 6 

Average Co-Inventor Count = 3.4

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017-2025

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6 patents (USPTO):Explore Patents

Title: Tatsuya Hirata: Innovator in Photosensitive Resin Technology

Introduction

Tatsuya Hirata is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of photosensitive resin compositions, particularly in the development of materials used in semiconductor devices. With a total of 6 patents to his name, Hirata's work has had a substantial impact on the industry.

Latest Patents

Hirata's latest patents focus on a negative-type photosensitive resin composition and methods for producing polyimide and cured relief patterns. His innovations provide a high chemical resistance and resolution while minimizing the occurrence of voids in the interface of a copper layer that contacts a resin layer after high-temperature storage evaluation. The negative photosensitive resin composition includes a polyimide precursor, a compound with urethane or urea bonds, and a photopolymerization initiator. These advancements ensure satisfactory resolution even with shifts in focus depth and exhibit excellent adhesion to mold resins, along with a low dielectric constant.

Career Highlights

Throughout his career, Tatsuya Hirata has worked with notable companies such as Asahi Kasei and Asahi Kasei E-materials Corporation. His experience in these organizations has allowed him to refine his expertise in materials science and innovation.

Collaborations

Hirata has collaborated with talented individuals in his field, including Takahiro Sasaki and Tomohiro Yorisue. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Tatsuya Hirata's contributions to the field of photosensitive resin technology demonstrate his innovative spirit and commitment to advancing semiconductor materials. His work continues to influence the industry and pave the way for future developments.

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