Asahi Kasei Kabushiki Kaisha

Asahi Kasei E-Materials Corporation

Asahi Kasei Pharma Corporation

Tatsuya Hirata

Takahiro Sasaki

Tomohiro Yorisue

Mitsutaka Nakamura

Takeshi Matsuoka

Satoshi Shibui

Masaru Yamakoshi

Taihei Inoue

Takeki Shimizu

Takanobu Fujioka

Suzuka Matsumoto

Taisuke Yamada

Kohei Murakami

Provided are a negative photosensitive resin composition and a method for forming a cured relief pattern using the same with which a high chemical resistance and resolution can be obtained and in which the occurrence of voids in the interface of a Cu layer contacting a resin layer after high-temperature storage evaluation can be suppressed. Provided is a negative photosensitive resin composition including (A) a polyimide precursor represented by general formula (1) below; (B) a compound having at least one selected from a urethane bond and a urea bond; and (C) a photopolymerization initiator. In the formula, X, Y, n, R, and Rare each as defined in the description of the present application.

Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same

To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.

Negative photosensitive resin composition, production method for polyimide, production method for cured relief pattern, and semiconductor device

The present invention addresses the problem of providing a method for producing nicotinamide mononucleotide, that produces nicotinamide mononucleotide using a single enzyme and using nucleoside monophosphate, pyrophosphate, and nicotinamide as starting materials. This problem is solved by a nicotinamide mononucleotide production method that includes at least the following steps 1) and 2): 1) a first step of producing phosphoribosyl diphosphate by the action of substantially one enzyme on nucleoside monophosphate and pyrophosphate; and 2) a second step of producing nicotinamide mononucleotide by the action of only substantially the aforementioned one enzyme on nicotinamide and the phosphoribosyl diphosphate that is the product of the first step.

Method for producing nicotinamide mononucleotide

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200&#xb0; C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

Photosensitive resin composition and method for producing cured relief pattern

Provided is a photosensitive resin composition which comprises: (A-1) a resin containing a structure represented by general formula (1); and (B) a photo-acid generating agent. In general formula (1), X, Rto R, mto m, n, n, Y and W are each as defined in the description. 

Photosensitive resin composition, method for producing hardened relief pattern, semiconductor device and display device

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Tokyo, Japan

Tatsuya Hirata