The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 24, 2024
Filed:
Jul. 29, 2020
Applicant:
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Inventors:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03F 7/038 (2006.01); C08G 73/12 (2006.01); G03F 7/029 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0387 (2013.01); C08G 73/126 (2013.01); G03F 7/029 (2013.01); H01L 23/293 (2013.01); H01L 23/5329 (2013.01); H01L 24/19 (2013.01); H01L 2224/19 (2013.01);
Abstract
To provide a negative photosensitive resin composition which exhibits satisfactory resolution even when shifts occur in focus depth, and which has satisfactory adhesion to a mold resin and exhibits a low dielectric constant; a method for producing a polyimide using the photosensitive resin composition; a method for producing a cured relief pattern; and a semiconductor device including the cured relief pattern. Disclosed is a negative photosensitive resin composition including a polyimide precursor having a structure represented by general formula (A1), (B) a photopolymerization initiator, and (C) a solvent.