Tatsuro Takamura

Title: Innovations by Tatsuro Takamura

Introduction

Tatsuro Takamura is a prominent inventor based in Tokyo, Japan. He is known for his contributions to the field of resin compositions, particularly in applications related to printed wiring boards. His innovative work has led to the development of materials that enhance the performance and reliability of electronic components.

Latest Patents

Takamura holds a patent for a resin composition that includes a high permittivity and low dissipation factor. This composition is designed to have a low coefficient of thermal expansion and an appealing appearance. The patent specifically addresses the production of insulation layers for printed wiring boards, as well as prepregs, resin sheets, laminates, and metal foil-clad laminates. The resin composition consists of BaTiO, a filler different from BaTiO, and a thermosetting resin. The median particle size of BaTiO is between 0.10 to 1.00 μm, with a volume ratio of BaTiO to the filler ranging from 15:85 to 80:20. This innovation is crucial for improving the performance of electronic devices.

Career Highlights

Tatsuro Takamura is affiliated with Mitsubishi Gas Chemical Company, Inc., where he has made significant contributions to materials science. His work has been instrumental in advancing the technology used in electronic components, particularly in enhancing the insulation properties of printed wiring boards.

Collaborations

Takamura has collaborated with notable colleagues, including Takaaki Ogashiwa and Tetsuro Miyahira. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas in the field of materials science.

Conclusion

Tatsuro Takamura's innovative work in resin compositions has made a significant impact on the electronics industry. His patent for a high-performance resin composition demonstrates his commitment to advancing technology and improving the reliability of electronic components.