The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2024
Filed:
Jan. 26, 2022
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Takaaki Ogashiwa, Tokyo, JP;
Tetsuro Miyahira, Tokyo, JP;
Tatsuro Takamura, Tokyo, JP;
Sayaka Ito, Tokyo, JP;
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Abstract
An object is to provide a resin composition having a high permittivity and a low dissipation factor, and also a low coefficient of thermal expansion and a good appearance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition contains: (A) BaTiO; (B) a filler different from the BaTiO(A); and (C) a thermosetting resin; wherein a median particle size of the BaTiO(A) is 0.10 to 1.00 μm, and a volume ratio of the BaTiO(A) to the filler (B), the BaTiO(A):the filler (B), ranges from 15:85 to 80:20.