Omihachiman, Japan

Tatsuji Yamada

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2004-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tatsuji Yamada. Retrieved from https://idiyas.com/inventor/tatsuji-yamada

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2004-2010

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2 patents (USPTO):Explore Patents

Title: Tatsuji Yamada: Innovator in Metal Plating Technology

Introduction

Tatsuji Yamada is a notable inventor based in Omihachiman, Japan. He has made significant contributions to the field of metal plating technology. With a total of 2 patents, Yamada has developed innovative solutions that enhance the uniformity of plating thickness in metal plating processes.

Latest Patents

Yamada's latest patents focus on improving metal plating apparatuses. The first patent describes a metal plating process that ensures uniform plating thickness by aligning lines of electric force uniformly and in parallel. This is achieved by using a pair of conductive perforated plates that are electrically connected to each other. These plates are positioned between the plating metals immersed in a plating solution and the object to be plated. The second patent reiterates this innovative approach, emphasizing the importance of uniform electric force alignment for achieving consistent plating results.

Career Highlights

Tatsuji Yamada is associated with International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to collaborate with other talented professionals in the field of technology and innovation.

Collaborations

Yamada has worked alongside his coworker, Johji Nakamoto, contributing to advancements in metal plating technology.

Conclusion

Tatsuji Yamada's contributions to metal plating technology through his patents reflect his dedication to innovation. His work continues to influence the industry, showcasing the importance of uniformity in plating processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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