The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
May. 24, 2001
Applicant:
Inventors:
Johji Nakamoto, Koga-gun, JP;
Tatsuji Yamada, Ohmihachiman, JP;
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 1/710 ;
U.S. Cl.
CPC ...
C25D 1/710 ;
Abstract
In order to make plating thickness uniform in a metal plating apparatus, a metal plating apparatus capable of performing metal plating to a uniform thickness is provided by aligning lines of electric force uniformly and in parallel by disposing a pair of conductive perforated plates and , which are electrically connected to each other, between plating metals immersed in a plating solution and an object to be plated.
Nakamoto, Johji. (2004). Metal plating apparatus and process (U.S. Patent No. 6827827). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6827827
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile