Tasuku Touyama

Title: Tasuku Touyama: Inventor in Copper-Clad Laminate and Circuit-Board Manufacturing

Introduction

Tasuku Touyama is an inventor associated with Shimizu, Japan. His listed work includes inventions related to copper-clad laminates and conductor circuit boards. He is credited with 3 patents.

Latest Patents

One of Touyama’s listed patents describes a process for producing a copper-clad laminate. The method forms copper foil on a planar conductive substrate through electrolysis, roughens the foil’s surface, and laminates it onto an insulating substrate using pressure and heat. The conductive substrate is then separated. Depending on the thickness of an optional metal film between the substrate and copper foil, that film may remain with the foil or separate with the conductive substrate.

The process also describes high-speed plating conditions intended to produce copper foil with flexibility comparable to rolled and annealed copper. This approach can enable ultrathin copper-clad laminates, including foil of 10 micrometers or less, for flexible circuit boards, while using relatively compact equipment and reducing production time.

Another listed patent is titled “Method of Producing Conductor Circuit Boards.” The supplied information does not include further details about its process.

Career Highlights

Touyama’s listed company affiliations include Meiko Electronics Co., Ltd. and Koito Seisakusho Co., Ltd. His patent work reflects an emphasis on materials and manufacturing processes for electronic circuit-board applications.

Collaborations

Tatsuo Wada and Teruaki Yamamoto are identified as Touyama’s coworkers. The available information does not specify their roles in the listed inventions.

Conclusion

Tasuku Touyama’s recorded inventions focus on copper-clad laminate production and conductor circuit-board manufacturing, with particular relevance to ultrathin materials for flexible electronics.