Tarcisio Cagnin

Title: Tarcisio Cagnin: Innovator in Dielectric Substrate Technology

Introduction

Tarcisio Cagnin is a notable inventor based in Milan, Italy. He has made significant contributions to the field of dielectric substrate technology. His innovative approach has led to the development of a unique patent that enhances the manufacturing process of metallized holes in dielectric substrates.

Latest Patents

Cagnin holds a patent for a "Process for making metallized holes in a dielectric substrate by vacuum." This process involves several steps, including the galvanic growth of conductive paths delimited by photoresist on the substrate. It also includes a drilling step of the substrate and the electrogalvanic creation of rivets that protrude beyond the edges of the holes on the front of the substrate. The completion of conductive and resistive paths on the front, deposition of metals on the back, reinforcement of the rivets, and galvanic growth of the back and of the metals deposited inside the hole follow this initial process.

Career Highlights

Cagnin is currently employed at Siemens Telecommunicazioni S.p.a., where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of dielectric substrates in telecommunications.

Collaborations

One of his notable collaborators is Giampiero Ferraris, with whom he has worked closely on various projects. Their partnership has contributed to the success of their innovations in the field.

Conclusion

Tarcisio Cagnin's contributions to dielectric substrate technology through his patent and work at Siemens Telecommunicazioni S.p.a. highlight his role as a key innovator in the industry. His advancements continue to influence the field and pave the way for future developments.