The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 1991
Filed:
Feb. 27, 1989
Applicant:
Inventors:
Tarcisio Cagnin, Milan, IT;
Giampiero Ferraris, Como, IT;
Assignee:
Siemens Telecommunicazioni S.p.A., Milan, IT;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C / ; C25D / ;
U.S. Cl.
CPC ...
430312 ; 430314 ; 430313 ; 430315 ; 430319 ; 430329 ; 204 15 ;
Abstract
A process for making metallized holes in a dielectric substrate which, after galvanic growth of the conductive paths delimited by photoresist on the substrate, includes a drilling step of the substrate and electrogalvanic creation of rivets protruding beyond the edges of the holes on the front of the substrate. The steps of completion of the conductive and resistive paths on the front, deposition of metals on the back, reinforcement of the rivets and galvanic growth of the back and of the metals deposited inside the hole then follow.