This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: National Yang Ming Chiao Tung University. Active years: 2016-2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hsinchu, TW (2016)
- Hsinchu County, TW (2018)
Company Filing History:
Years Active: 2016-2018
Title: Innovations of Taochi Liu in Electrodeposited Nano-Twins Copper Layer
Introduction
Taochi Liu is a prominent inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper layers for semiconductor applications. With a total of 2 patents, his work is recognized for its innovative approach and practical applications.
Latest Patents
One of Taochi Liu's latest patents is focused on an electrodeposited nano-twins copper layer and the method of fabricating the same. This invention discloses a copper layer that comprises at least 50% in volume of plural grains adjacent to each other. These grains are made of stacked twins, with the angle of the stacking directions of the nano-twins between one grain and the neighboring grain ranging from 0 to 20 degrees. The electrodeposited nano-twins copper layer is noted for its high reliability, excellent electro-migration resistance, hardness, and Young's modulus. Furthermore, the manufacturing method is fully compatible with semiconductor processes, making it a valuable advancement in the industry.
Career Highlights
Taochi Liu is affiliated with National Yang Ming Chiao Tung University, where he continues to engage in research and development. His work has not only contributed to academic knowledge but has also paved the way for practical applications in technology and industry.
Collaborations
Throughout his career, Taochi Liu has collaborated with notable colleagues, including Chih Hung Chen and King-Ning Tu. These partnerships have enhanced the scope and impact of his research, leading to innovative solutions in materials science.
Conclusion
Taochi Liu's contributions to the field of electrodeposited nano-twins copper layers exemplify the intersection of innovation and practical application. His patents reflect a commitment to advancing technology in semiconductor processes, showcasing the importance of research in driving industry standards.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile