Shanghai, China

Tao Fei

This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Siemens Aktiengesellschaft, Siemens Ltd., China. Active years: 2024-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Tao Fei. Retrieved from https://idiyas.com/inventor/tao-fei-dwl17rtv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 2 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.7

ph-index = 1


Company Filing History:


Years Active: 2024-2025

Loading Chart...
Loading Chart...
2 patents (USPTO):Explore Patents

Title: Innovations of Tao Fei in Point Cloud Modeling

Introduction: Tao Fei is an accomplished inventor based in Shanghai, China. He has made significant contributions to the field of point cloud modeling, particularly through his innovative patent. His work focuses on enhancing the efficiency and accuracy of cutting methods for point cloud structures.

Latest Patents: Tao Fei holds a patent for a cutting method, apparatus, and system for point cloud models. This patent outlines a method that utilizes a two-dimensional first cutting window to select a point cloud structure containing a target object. The process involves adjusting the dimensions of the cutting window to create a three-dimensional second cutting window, identifying and marking point cloud structures, and calculating volume ratios to optimize the selection of the target object.

Career Highlights: Tao Fei is currently employed at Siemens Ltd., China, where he applies his expertise in point cloud modeling. His innovative approach has positioned him as a key figure in the development of advanced cutting methods in this field.

Collaborations: Tao Fei collaborates with his coworker, Hai Feng Wang, to further enhance their research and development efforts in point cloud technology.

Conclusion: Tao Fei's contributions to point cloud modeling through his innovative patent demonstrate his commitment to advancing technology in this area. His work at Siemens Ltd., China, continues to influence the field positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…