The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Jun. 28, 2019
Applicant:

Siemens Ltd., China, Beijing, CN;

Inventors:

Hai Feng Wang, Shanghai, CN;

Tao Fei, Shanghai, CN;

Assignee:

Siemens Ltd., China, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06T 17/00 (2006.01); G06T 19/00 (2011.01);
U.S. Cl.
CPC ...
G06T 17/00 (2013.01); G06T 19/00 (2013.01); G06T 2210/56 (2013.01);
Abstract

Provided are a cutting method, apparatus and system for a point cloud model. In an embodiment, the method includes: using one two-dimensional first cutting window to select a point cloud structure comprising a target object from among one point cloud model; adjusting the depth of the first cutting window, the length, width and depth of the first cutting window constituting one three-dimensional second cutting window, the target object being located in the second cutting window; identifying and marking all point cloud structures in the second cutting window to form a plurality of three-dimensional third cutting windows, the target object being located in one of the third cutting windows; and calculating the volume ratio of the point cloud structure in each third cutting window relative to the second cutting window, and selecting the third cutting window having the largest volume ratio.


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