Company Filing History:
Years Active: 2020-2022
Title: Innovations by Inventor Tangyii Sim in Wiring Substrate Technology
Introduction: Tangyii Sim is an innovative inventor based in Tokyo, Japan, known for his contributions in the field of wiring substrate technology. With a total of two patents to his name, Sim is making waves in the industry, particularly through his work with Showa Denko Materials Co., Ltd.
Latest Patents: Among Sim's notable inventions are the patents for a conductor substrate and a wiring substrate, along with a method for producing the wiring substrate. These patents disclose a unique wiring substrate that includes a stretchable resin layer, combined with a conductor foil or conductor plating film that forms a wiring pattern. Additionally, he has developed a stretchable member with a metal foil, which consists of a stretchable resin base material and a conductive metal foil. The innovative aspect of this member is the roughened surface of the metal foil on the stretchable resin base material side, featuring a surface roughness Ra of 0.1 μm to 3 μm.
Career Highlights: Sim's career at Showa Denko Materials Co., Ltd. has been marked by significant advancements in the materials used for electronic components. His patents showcase his commitment to improving the functionality and efficiency of wiring substrates, demonstrating his role as a thought leader in the technology sector.
Collaborations: Throughout his career, Sim has collaborated with distinguished colleagues such as Takeshi Masaki and Kumpei Yamada. Their teamwork has contributed to the successful development of state-of-the-art materials that cater to the evolving needs of the electronics industry.
Conclusion: Tangyii Sim's innovative work in wiring substrate technology highlights the importance of ongoing research and development in the field. With his patents and collaborations, Sim continues to contribute towards enhancing electronic component efficiency, solidifying his position as a prominent inventor in the industry.