The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Nov. 14, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Takeshi Masaki, Tokyo, JP;
Tangyii Sim, Tokyo, JP;
Kumpei Yamada, Tokyo, JP;
Tadahiro Ogawa, Tokyo, JP;
Takashi Kawamori, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0283 (2013.01); H05K 1/0393 (2013.01); H05K 1/118 (2013.01); H05K 1/189 (2013.01); H05K 3/4635 (2013.01);
Abstract
Disclosed is a wiring substrateincluding a stretchable resin layerand a conductor foil or conductor plating filmwhich is provided on the stretchable resin layerand forms a wiring pattern.