This inventor holds 1 USPTO granted patent. Top assignee: National Semiconductor Corporation. Active years: 2007.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2007
Title: Innovator Spotlight: Tan Eng Hwa and His Contribution to Semiconductor Packaging
Introduction: Tan Eng Hwa, an esteemed inventor based in Melaka, Malaysia, has made significant strides in the field of semiconductor packaging. With a focus on mitigating mechanical stress within semiconductor devices, his innovative solutions have proven essential in enhancing the reliability and performance of such components.
Latest Patents: Tan's most notable patent is for a "Stress Relieving Film for Semiconductor Packages." This invention introduces techniques aimed at reducing the mechanical stress that protective molding compounds exert on semiconductor dice, particularly during temperature fluctuations. By attaching a thermoplastic material to the top surface of a semiconductor die, Tan's design effectively serves as a cushion, allowing for the expansion and contraction of components without compromising the integrity of bond pads. This novel approach has the potential to substantially improve the longevity and effectiveness of semiconductor packages.
Career Highlights: Tan Eng Hwa's professional journey has led him to become a valuable asset at National Semiconductor Corporation, where he continues to leverage his expertise in materials science and engineering. His contributions to the company and the semiconductor industry as a whole underscore his commitment to innovation and excellence. With one registered patent to his name, his work exemplifies the intersection of theory and practical application in technology.
Collaborations: Throughout his career, Tan has collaborated with talented colleagues such as Lim Peng Soon and Santhiran S/o Nadarajah. These collaborations not only enhance the workplace environment but also foster a culture of innovation and shared knowledge, ensuring that cutting-edge solutions are developed effectively.
Conclusion: Tan Eng Hwa's innovations in semiconductor packaging reflect a dedication to improving technology that directly impacts everyday life. His stress-relieving film for semiconductor packages is a testament to the importance of inventors in driving forward advancements in various industries. With his ongoing work and collaborations, Tan continues to be an influential figure in the realm of semiconductor technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile