The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 06, 2007
Filed:
Jul. 29, 2004
Tan Eng Hwa, Melaka, MY;
Lim Peng Soon, Melaka, MY;
Santhiran S/o Nadarajah, Melaka, MY;
Ong Sze Yan, Melaka, MY;
Tan Eng Hwa, Melaka, MY;
Lim Peng Soon, Melaka, MY;
Santhiran S/O Nadarajah, Melaka, MY;
Ong Sze Yan, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.