Tameyoshi Hirano

Title: Tameyoshi Hirano: Innovator in Semiconductor Manufacturing

Introduction

Tameyoshi Hirano is a notable inventor based in Hiroshima, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent that streamlines the wafer production process. His work has implications for efficiency and quality in semiconductor fabrication.

Latest Patents

Hirano holds a patent for a "Method of manufacturing semiconductor wafers and process of." This invention features a unique approach to flattening a sliced wafer into a thin disc-like form. The process involves simultaneous double side grinding, which allows for the wafer to be passed between paired cylindrical grinding rolls. This method eliminates the need for a lapping step and an etching step, thereby reducing process time. The grinding technique is designed to avoid slice mark transfer and allows for continuous grinding, ensuring high flatness and stable thickness.

Career Highlights

Hirano is associated with Shin-Etsu Handotai Co., Ltd., a leading company in the semiconductor industry. His work has contributed to advancements in manufacturing techniques that enhance the quality and efficiency of semiconductor wafers. His innovative approach has positioned him as a key figure in the field.

Collaborations

Hirano has collaborated with notable colleagues such as Fumihiko Hasegawa and Makoto Kobayashi. These partnerships have fostered an environment of innovation and have led to significant advancements in semiconductor technology.

Conclusion

Tameyoshi Hirano's contributions to semiconductor manufacturing through his innovative patent demonstrate his commitment to improving production processes. His work continues to influence the industry and showcases the importance of innovation in technology.