Company Filing History:
Years Active: 2013-2014
Title: Takuya Torii - Innovator in Multilayered Wiring Substrates.
Introduction: Takuya Torii is an inventor based in Komaki-shi, Japan. He is known for his innovative work in the field of multilayer wiring substrates. Although he currently holds no granted patents, his contributions to the development of advanced wiring technologies are noteworthy.
Latest Patent Applications: Takuya Torii has submitted several patent applications that focus on enhancing the reliability and efficiency of wiring substrates. One of his latest applications is for a **MULTILAYERED WIRING SUBSTRATE**. The objective of this invention is to provide a multilayer wiring substrate that can reliably accommodate a capacitor, even when the core substrate is thinned. The design includes a sheetlike capacitor element, a resin filler, and via conductors. The capacitor element is configured with a dielectric layer sandwiched between electrode layers, ensuring effective functionality.
Another significant application is for a **METHOD FOR MANUFACTURING WIRING SUBSTRATE**. This method aims to create a wiring substrate with excellent connection reliability, allowing for the mounting of semiconductor chips. The process involves forming build-up layers on both the front and back surfaces, which include conductive layers and resin insulation layers. This innovative approach enhances the overall performance of the wiring substrate.
Conclusion: Takuya Torii's work in multilayer wiring substrates showcases his commitment to advancing technology in this field. His latest patent applications reflect his innovative spirit and dedication to improving electronic components.