The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 05, 2013

Filed:

Feb. 11, 2011
Applicants:

Masaki Muramatsu, Nagoya, JP;

Kenji Nishio, Komaki, JP;

Kazunaga Higo, Inuyama, JP;

Hironori Sato, Kasugai, JP;

Takuya Torii, Komaki, JP;

Masao Izumi, Konan, JP;

Inventors:

Masaki Muramatsu, Nagoya, JP;

Kenji Nishio, Komaki, JP;

Kazunaga Higo, Inuyama, JP;

Hironori Sato, Kasugai, JP;

Takuya Torii, Komaki, JP;

Masao Izumi, Konan, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method including a wiring groove forming step of forming a wiring groove in the resin insulating layer by irradiating a surface of the resin insulating layer with a laser, and a wiring layer forming step of forming the conductor layer such that at least a portion of the conductor layer is embedded in the wiring groove to form a wiring layer in the wiring groove.


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