This inventor holds 5 USPTO granted patents and 2 published patent applications. Top assignee: Fujitsu Corporation. Active years: 2006-2012.
Company Filing History:
Years Active: 2006-2012
Title: Takuya Ohno: Innovator in Bonded Substrate Fabrication
Introduction
Takuya Ohno is a prominent inventor based in Kasugai, Japan. He has made significant contributions to the field of substrate fabrication, holding a total of 5 patents. His work focuses on improving the efficiency and quality of bonded substrates, which are essential in various technological applications.
Latest Patents
One of Takuya Ohno's latest patents is an apparatus and method for fabricating bonded substrates. This innovative device is designed to reduce the number of defective bonded substrates produced during the fabrication process. The apparatus utilizes a transfer robot that sucks the outer edge area of the bottom surface of a substrate. It then spouts gas toward the bottom surface to carry the substrate into a vacuum process chamber of a press machine while maintaining a horizontal position. A press plate holds the substrate, which is secured by the transfer robot, by suction.
Career Highlights
Takuya Ohno is currently employed at Fujitsu Corporation, where he continues to develop cutting-edge technologies in substrate fabrication. His expertise and innovative approach have made him a valuable asset to the company.
Collaborations
Some of Takuya Ohno's notable coworkers include Takanori Muramoto and Tsukasa Adachi. Their collaborative efforts contribute to the advancement of technology in their field.
Conclusion
Takuya Ohno's contributions to the field of bonded substrate fabrication highlight his innovative spirit and dedication to improving manufacturing processes. His patents reflect a commitment to reducing defects and enhancing efficiency in technology.