Shimotsuma, Japan

Takuya Nagamine

This inventor holds 1 USPTO granted patent. Top assignee: Lsi Logic Corporation. Active years: 2002.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Takuya Nagamine. Retrieved from https://idiyas.com/inventor/takuya-nagamine-nvg6z6s3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Takuya Nagamine and CMP Slurry Recycling

Introduction

Takuya Nagamine is an inventor associated with Shimotsuma, Japan, and LSI Logic Corporation. His patent work addresses the recovery and reuse of chemical mechanical planarization (CMP) slurry, a material used in semiconductor manufacturing.

Latest Patents

Nagamine is named on 1 patent: “CMP Slurry Recycling Apparatus and Method for Recycling CMP Slurry.” The invention describes a CMP apparatus in which the polishing table is smaller in diameter than the polishing pad. The pad covers the table’s top surface, leaving a space beneath its projecting outer edge. A trough positioned around the table’s outer perimeter extends partly into this space and collects used slurry for recycling.

Career Highlights

Nagamine’s patent reflects an engineering focus on slurry collection and reuse in CMP processes. The apparatus’s arrangement is designed to withdraw used slurry from beneath the portion of the polishing pad that extends beyond the polishing table.

Collaborations

Toru Kikuchi and Hiroshi Mizuno are listed as Nagamine’s coworkers. The available information does not specify their roles in the patent or their contributions to the invention.

Conclusion

Takuya Nagamine’s documented patent concerns an apparatus and method for collecting and recycling CMP slurry, connecting his inventive work with semiconductor manufacturing and resource reuse.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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