This inventor holds 1 USPTO granted patent. Top assignee: Threebond Co., Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Takuya Hisanaga: Innovator in Curable Resin Technology
Introduction
Takuya Hisanaga is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of curable resin compositions, showcasing his expertise and innovative spirit. His work focuses on developing materials that enhance bonding capabilities without relying on traditional catalysts.
Latest Patents
Hisanaga holds a patent for a curable resin composition, which is notable for its excellent surface and internal curability. This invention allows for the bonding of adherend members without the use of an organic tin catalyst. The composition includes several key components: an epoxy resin with two or more epoxy groups, a bismuth catalyst, water with a pH of 8.0 or more, an organic polymer with hydrolyzable silyl groups, and a curing agent for epoxy resin. His patent is a testament to his innovative approach in material science.
Career Highlights
Hisanaga is associated with Threebond Co., Ltd., a company known for its advancements in adhesive technologies. His work at Threebond has allowed him to apply his inventive ideas in practical applications, contributing to the company's reputation in the industry.
Collaborations
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Conclusion
Takuya Hisanaga's contributions to curable resin technology exemplify his innovative mindset and dedication to advancing material science. His patent reflects a significant step forward in bonding technology, showcasing the potential for environmentally friendly solutions in industrial applications.