This inventor holds 2 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignee: Toray Industries, Inc.. Active years: 2025-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2025-2026
Title: Takumi Honda: Innovator in Sandwich Structure Technology
Introduction
Takumi Honda is a notable inventor based in Iyo-gun, Japan. He has made significant contributions to the field of materials science, particularly in the development of sandwich structures that enhance both heat dissipation and mechanical properties.
Latest Patents
One of Takumi Honda's key patents is titled "Sandwich structure and method for manufacturing same." The purpose of this invention is to provide a sandwich structure that possesses excellent heat dissipation properties alongside superior mechanical characteristics. The innovative design includes a core member and fiber reinforced members on both sides. The core member features a sheet-shaped heat conductive member with an impressive in-plane thermal conductivity of 300 W/m·K or more. This patent highlights Honda's commitment to advancing material technology.
Career Highlights
Takumi Honda is currently associated with Toray Industries, Inc., a leading company in advanced materials. His work at Toray has allowed him to focus on innovative solutions that address modern engineering challenges. With a total of 1 patent to his name, Honda continues to push the boundaries of what is possible in material design.
Collaborations
Throughout his career, Takumi Honda has collaborated with talented individuals such as Takafumi Suzuki and Masato Honma. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.
Conclusion
In summary, Takumi Honda is a distinguished inventor whose work in sandwich structure technology has the potential to revolutionize material applications. His dedication to innovation and collaboration exemplifies the spirit of advancement in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
