The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2025
Filed:
Nov. 11, 2020
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
TORAY INDUSTRIES, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 21/00 (2006.01); B29C 70/42 (2006.01); B29C 70/68 (2006.01); B29K 63/00 (2006.01); B29K 307/04 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01);
U.S. Cl.
CPC ...
F28D 21/00 (2013.01); B32B 5/024 (2013.01); B32B 5/263 (2021.05); B29C 70/42 (2013.01); B29C 70/68 (2013.01); B29K 2063/00 (2013.01); B29K 2307/04 (2013.01); B29K 2995/0013 (2013.01); B32B 2250/20 (2013.01); B32B 2250/40 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/106 (2013.01); B32B 2307/546 (2013.01); B32B 2307/732 (2013.01); F28D 2021/0029 (2013.01);
Abstract
The purpose of the present invention is to provide a sandwich structure that has both excellent heat dissipation properties and excellent mechanical properties. In order to achieve this purpose, the sandwich structure of the present invention has the following structure. The sandwich structure includes a core member (I), and a fiber reinforced member (II) disposed on both sides of the core member (I), wherein the core member (I) includes a sheet-shaped heat conductive member (III) having an in-plane thermal conductivity of 300 W/m·K or more.