Kouga, Japan

Takuma Yoshisaka


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2015

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1 patent (USPTO):Explore Patents

Title: **Innovator Spotlight: Takuma Yoshisaka**

Introduction

Takuma Yoshisaka is a notable inventor based in Kouga, Japan. He has contributed significantly to the field of adhesive resin compositions, showcasing his expertise through a patent that addresses key industry requirements such as halogen-free materials and enhanced performance characteristics.

Latest Patents

Yoshisaka holds a patent titled "Adhesive resin compositions, and laminates and flexible printed wiring boards using same." This innovative adhesive resin composition is designed to be halogen-free, offering excellent adhesiveness, solder heat resistance, and flame retardancy. The composition combines a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin (with a weight-average molecular weight of more than 20,000 and 150,000 or less), another thermoplastic resin, and a curing agent. Additionally, the adhesive may include a benzoxazine compound while minimizing the presence of inorganic fillers.

Career Highlights

Throughout his career, Takuma Yoshisaka has worked with prestigious organizations, including Sumitomo Electric Industries and Sumitomo Electric Printed Circuits. These affiliations have allowed him to integrate his innovative approaches with industry practices, advancing the development of adhesive technologies.

Collaborations

Yoshisaka has collaborated with esteemed colleagues, including Shingo Kaimori and Jun Sugawara. Together, they have contributed to the evolution of adhesive resin compositions, emphasizing the importance of teamwork in driving innovation and enhancing product performance.

Conclusion

Takuma Yoshisaka stands out as a dedicated inventor whose contributions to adhesive technology mark a significant advancement in the field. His patented adhesive resin compositions not only reflect his innovative spirit but also his commitment to creating safer and more efficient materials for various applications in industry. His work continues to inspire future innovations in adhesive technologies.

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