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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9181464 B1

PDFFull Text
Date of Patent:
Nov. 10, 2015

Filed:

Jan. 18, 2010

Adhesive resin compositions, and laminates and flexible printed wiring boards using same

Applicants:

Shingo Kaimori, Osaka, JP;

Jun Sugawara, Osaka, JP;

Akira Mizoguchi, Osaka, JP;

Syougo Asai, Kouga, JP;

Takuma Yoshisaka, Kouga, JP;

Naota Uenishi, Kouga, JP;

Inventors:

Shingo Kaimori, Osaka, JP;

Jun Sugawara, Osaka, JP;

Akira Mizoguchi, Osaka, JP;

Syougo Asai, Kouga, JP;

Takuma Yoshisaka, Kouga, JP;

Naota Uenishi, Kouga, JP;

Assignees:

SUMITOMO ELECTRIC INDUSTRIES, LTD., Osaka, JP;

SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., Shiga, JP;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Mark Ruthkosky

Assistant Examiner:

Ian Rummel

Int. Cl.
CPC ...
B32B 3/10 (2006.01); B32B 7/12 (2006.01); C09J 7/02 (2006.01); C09J 167/02 (2006.01); C09J 163/04 (2006.01); C09J 171/10 (2006.01); C09J 163/02 (2006.01); C09J 177/00 (2006.01); C09J 161/14 (2006.01); C09J 167/00 (2006.01); C08G 59/30 (2006.01); C08G 59/32 (2006.01); C09J 163/00 (2006.01); C09J 171/00 (2006.01); H05K 3/38 (2006.01); C08K 5/3437 (2006.01); C08L 67/00 (2006.01); C08L 77/00 (2006.01); C08L 79/04 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C09J 167/00 (2013.01); C08G 59/304 (2013.01); C08G 59/3272 (2013.01); C09J 7/0242 (2013.01); C09J 163/00 (2013.01); C09J 171/00 (2013.01); H05K 3/386 (2013.01); C08G 2650/56 (2013.01); C08K 5/3437 (2013.01); C08L 67/00 (2013.01); C08L 77/00 (2013.01); C08L 79/04 (2013.01); C09J 2203/326 (2013.01); C09J 2205/102 (2013.01); C09J 2461/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/00 (2013.01); C09J 2477/00 (2013.01); H01L 2924/00013 (2013.01); H05K 1/0393 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0145 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/287 (2015.01);
Abstract

Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.

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