Takuma Sugai

Title: The Innovations of Takuma Sugai

Introduction

Takuma Sugai is a notable inventor based in Niigata, Japan. He has made significant contributions to the field of materials science, particularly in the development of thermosetting resin compositions. His innovative work has led to the creation of a patent that showcases his expertise and creativity.

Latest Patents

Takuma Sugai holds a patent for a thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board. This thermosetting resin composition includes a solid epoxy resin that is solid at 25° C, a non-solid epoxy resin that is non-solid at 25° C, and particulate rubber dispersed in the non-solid epoxy resin. Additionally, it contains a curing agent, an inorganic filler, and polycarbonate diol-derived polyurethane. The composition specifies that the content of the particulate rubber ranges from 3 to 15 parts by mass concerning the total parts by mass of the solid and non-solid epoxy resins. The acid value of the polycarbonate diol-derived polyurethane is between 10 to 30 mgKOH/g, and its weight average molecular weight is from 15,000 to 50,000.

Career Highlights

Takuma Sugai is currently employed at Arisawa Mfg. Co., Ltd., where he continues to innovate and develop new materials. His work has been instrumental in advancing the capabilities of flexible printed wiring boards, which are essential in modern electronics.

Collaborations

Throughout his career, Takuma has collaborated with talented individuals such as Takashi Gondaira and Katsuhiko Furukawa. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of groundbreaking technologies.

Conclusion

Takuma Sugai's contributions to the field of materials science, particularly through his patented innovations, highlight his role as a leading inventor in Japan. His work continues to influence the industry and pave the way for future advancements.