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Arisawa Mfg. Co., Ltd.

USPTO Granted Patents = 68

EPO Patents = 18

Trademarks = 1

Forward Citations = 208

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99 inventors (with patents filed for the assignee):

Hajime Maruta (14 out of 14 patents)

Makoto Tai (10 out of 10 patents)

Masatoshi Niwa (10 out of 10 patents)

4. Hiroshi Tanaka (9 out of 13 patents)

5. Hiroyuki Matsuyama (7 out of 9 patents)

6. Masaaki Hirai (6 out of 6 patents)

7. Takashi Gondaira (5 out of 5 patents)

8. Yuichi Kakubari (5 out of 5 patents)

9. Sanji Arisawa (5 out of 6 patents)

10. Shuichi Fujita (4 out of 4 patents)

11. Yoshinori Sato (4 out of 5 patents)

12. Yuichi Kawai (4 out of 5 patents)

13. Kenichi Watabe (4 out of 4 patents)

14. Kei Fukaishi (4 out of 4 patents)

15. Sadao Ioki (4 out of 4 patents)

Core Competencies:

Polyimide Resin

Flexible Printed Wiring Board

Photosensitive Resin Composition

Stereoscopic Image Display

Optical Diffraction Element

Fiber-Reinforced Resin

Pressure Vessel

Thermosetting Resin Composition

Sandwich Panel

Multi-Layer Film

Vacuum Pump

68 patents: Sort by Forward Citations

1. 12351684 - Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board (2025-07-08),

2. 12179845 - Connection member for vehicle structure (2024-12-31),

3. 12122867 - Photocurable resin composition and use thereof (2024-10-22),

4. 11976171 - Polyimide resin precursor, polyimide resin, metal-clad laminated board, laminate, and flexible printed wiring board (2024-05-07),

5. 11946143 - Laminate (2024-04-02),

6. 11942665 - Separator member for fuel cell, and method for manufacturing said separator member (2024-03-26),

7. 11918983 - Pressure vessel (2024-03-05),

8. 11884815 - Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board (2024-01-30),

9. 11865794 - Prepreg and method for manufacturing molded prepreg article (2024-01-09),

10. 11760838 - Polyimide resin precursor (2023-09-19),

11. 11609493 - Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed circuit and image display device (2023-03-21),

12. 11402754 - Photosensitive resin composition, solder resist film using said photosensitive resin composition, flexible printed wiring board, and image display device (2022-08-02),

13. 11376826 - Multi-layer film and metal laminate (2022-07-05),

14. 11317507 - Laminate and method for manufacturing the same (2022-04-26),

15. 11118013 - Polyimide resin precursor (2021-09-14),

Arisawa Manufacturing Co., Ltd. (ARISAWA) is a global leader in the production of advanced technology products using fine-pitch optical screen technology. Established in 1953, ARISAWA specializes in the development and manufacturing of optical products such as backlight units for LCDs, optical films, and lighting solutions for various industries including automotive, electronics, and medical. With a commitment to innovation and high-quality products, ARISAWA constantly strives to meet the evolving demands of its customers worldwide.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 23 2025

68 Patents

#3 in Niigata

#1,390 in Japan

#10,453 in the World

Arisawa Mfg. Co., Ltd.

Forward Citations = 208

99 inventors:

Hajime Maruta (14 out of 14 patents)

Makoto Tai (10 out of 10 patents)

Masatoshi Niwa (10 out of 10 patents)

4. Hiroshi Tanaka (9 out of 13 patents)

5. Hiroyuki Matsuyama (7 out of 9 patents)

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