The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 02, 2024

Filed:

Sep. 04, 2019
Applicant:

Arisawa Mfg. Co., Ltd., Joetsu, JP;

Inventors:

Kenji Nakamura, Niigata, JP;

Yoshihiko Konno, Niigata, JP;

Hiroyuki Matsuyama, Niigata, JP;

Makoto Tai, Niigata, JP;

Shuichi Fujita, Niigata, JP;

Assignee:

Arisawa Mfg. Co., Ltd., Niigata, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/28 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C23C 18/28 (2013.01); H05K 1/036 (2013.01); H05K 3/0064 (2013.01); H05K 3/381 (2013.01); H05K 2203/061 (2013.01); H05K 2203/0716 (2013.01); H05K 2203/072 (2013.01);
Abstract

A laminate comprising a substrate; and a plating-forming layer disposed on at least one surface of both surfaces of the substrate and containing a thermoplastic resin and a plating catalyst, wherein the plating-forming layer further satisfies conditions of the following (1) and/or (2),


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