This inventor holds 3 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 1993-2001.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Gifu, JP (1993)
- Ohgaki, JP (2000 - 2001)
Company Filing History:
Years Active: 1993-2001
Title: Takuji Asai: Innovator in Electronic Component Mounting
Introduction
Takuji Asai is a notable inventor based in Ohgaki, Japan. He has made significant contributions to the field of electronic component mounting, holding a total of 3 patents. His innovative designs focus on improving the efficiency and reliability of electronic assemblies.
Latest Patents
One of Takuji Asai's latest patents is a substrate for mounting electronic parts. This invention allows a conductive pin to be inserted and secured in a through hole without causing any damage. The substrate consists of a through hole piercing an insulating substrate, with a conductive pin whose head is inserted into the hole. The head features multiple projections extending radially in four or more directions. These projections are organized into pairs, each extending in opposite directions from the axial center of the head. The primary projection pair has the largest length, equal to or greater than the inside diameter of the through hole, while the secondary projection pair is shorter than the inside diameter.
Career Highlights
Takuji Asai is associated with Ibiden Company Limited, where he continues to develop innovative solutions for electronic component mounting. His work has been instrumental in advancing the technology used in electronic devices.
Collaborations
He has collaborated with notable coworkers such as Masataka Sekiya and Tsunehisa Takahashi, contributing to various projects that enhance electronic manufacturing processes.
Conclusion
Takuji Asai's contributions to the field of electronic component mounting demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the challenges in electronic assembly, paving the way for future advancements in the industry.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
