Takeshi Yokoyama

Title: The Innovations of Takeshi Yokoyama

Introduction

Takeshi Yokoyama is a prominent inventor based in Matsumoto, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on enhancing the efficiency and reliability of electronic components.

Latest Patents

One of Yokoyama's latest patents is related to a solder joint. This invention involves a solder joint layer that includes a melted solder material with Sn as the main component, along with Ag, Sb, and Cu. The joined body features a Ni—P—Cu plating layer that interacts with the solder joint layer. This plating layer is designed to improve the performance and durability of the solder joint.

Another notable patent is for an assembly jig set and manufacturing method of a semiconductor module. This assembly jig set consists of a first outer frame jig and multiple inner piece jigs that are precisely positioned. One of the inner piece jigs includes several opening portions for the accurate positioning of semiconductor chips. This innovation streamlines the manufacturing process of semiconductor modules.

Career Highlights

Yokoyama has worked with notable companies such as Fuji Electric Co., Ltd. and Fuji Electric Device Technology Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Yokoyama has collaborated with talented individuals, including Tomonori Seki and Kazunaga Onishi. These partnerships have contributed to the advancement of his projects and inventions.

Conclusion

Takeshi Yokoyama's contributions to the field of semiconductor technology are noteworthy. His innovative patents and collaborations reflect his commitment to advancing electronic components. His work continues to influence the industry and inspire future innovations.