The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 20, 2021
Filed:
Dec. 27, 2019
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventors:
Bin Wan Mat Wan Azha, Matsumoto, JP;
Takeshi Yokoyama, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 12/00 (2006.01); H05K 3/34 (2006.01); H01L 23/498 (2006.01); H01L 25/07 (2006.01); H05K 3/30 (2006.01); H05K 3/40 (2006.01); H01L 23/00 (2006.01); B23K 3/04 (2006.01);
U.S. Cl.
CPC ...
H05K 3/341 (2013.01); B23K 3/04 (2013.01); H01L 23/49811 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H05K 3/301 (2013.01); H05K 3/303 (2013.01); H05K 3/4015 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H05K 2201/1031 (2013.01);
Abstract
A pressing area set on a main surface of a plate-shaped holding jig is arranged on contact parts. The contact parts are pressed against a multilayer board while heating the multilayer board and the pressing area of the holding jig is inclined with a warp of the multilayer board. In this way, when pressing for bonding the contact parts is performed, even if the multilayer board is warped by the heating and the contact parts are shifted, the contact parts are pressed against the multilayer board without fail.