Takeshi Uehara

Title: Innovations by Takeshi Uehara

Introduction

Takeshi Uehara is a prominent inventor based in Koshi, Japan. He has made significant contributions to the field of substrate treatment technology, holding a total of 7 patents. His work focuses on improving the efficiency and effectiveness of coating processes for substrates.

Latest Patents

Uehara's latest patents include a substrate treatment apparatus and a substrate treatment method. The substrate treatment method involves supplying a coating solution to a substrate with projections and depressions on its front surface. This process forms a coating film on the substrate, which is then heated to adjust the etching condition of the coating film. Following this, an etching solution is applied to etch the coating film, and subsequently, a coating solution is reapplied to create a flat coating film. The substrate is then heated to cure the coating film, achieving uniformity and high accuracy without the need for high-load processes like chemical mechanical polishing. The substrate treatment apparatus includes a holding means for rotatably holding the substrate, a coating solution supply nozzle, a treatment container, an exhaust means, a multiblade centrifugal fan, and a controller to manage the airflow and substrate rotation.

Career Highlights

Takeshi Uehara is associated with Tokyo Electron Limited, a leading company in the semiconductor and electronics manufacturing industry. His innovative approaches have contributed to advancements in substrate treatment technologies, enhancing the quality and efficiency of manufacturing processes.

Collaborations

Uehara has worked alongside notable colleagues such as Shouichi Terada and Tsuyoshi Mizuno. Their collaborative efforts have further propelled advancements in their field.

Conclusion

Takeshi Uehara's contributions to substrate treatment technology exemplify the impact of innovation in manufacturing processes. His patents reflect a commitment to enhancing efficiency and precision in the industry.