Tokyo, Japan

Takeshi Asagi

This inventor holds 3 USPTO granted patents and 1 published patent application. Top assignees: Fuji Electric Co., Ltd., Nihon Handa Co., Ltd.. Active years: 2015-2019.

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Tokyo, JP (2015 - 2016)
  • Ichihara, JP (2019)

Company Filing History:


Years Active: 2015-2019

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3 patents (USPTO):Explore Patents

Title: The Innovations of Takeshi Asagi

Introduction

Takeshi Asagi is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of soldering technology, particularly in the development of lead-free solder alloys. With a total of 3 patents, Asagi's work focuses on enhancing the performance and reliability of solder materials used in electronic components.

Latest Patents

Asagi's latest patents include innovative solutions for die bonding and soldering electronic parts. One of his key inventions is a lead-free solder alloy designed for die bonding, which contains a specific percentage of antimony to improve heat resistance and wetting properties. Another notable patent is a method of soldering electronic parts using a cream solder made from an Sn–Ag–Cu alloy. This cream solder is characterized by its excellent strength, thermal stability, and bonding properties, making it suitable for high-temperature applications.

Career Highlights

Throughout his career, Takeshi Asagi has worked with prominent companies such as Fuji Electric Co., Ltd. and Nihon Handa Co., Ltd. His experience in these organizations has allowed him to refine his expertise in solder technology and contribute to advancements in the industry.

Collaborations

Asagi has collaborated with talented individuals in his field, including Mitsuo Yamashita and Tomoaki Goto. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Takeshi Asagi's contributions to solder technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to improving the performance and reliability of solder materials, which are crucial for modern electronic devices.

Profile summary based on public USPTO records.
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