The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 2019
Filed:
Jan. 21, 2014
Applicants:
Nihon Handa Co., Ltd., Tokyo, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Inventors:
Takeshi Asagi, Ichihara, JP;
Susumu Mitani, Ichihara, JP;
Hirohiko Watanabe, Kawasaki, JP;
Masayoshi Shimoda, Kawasaki, JP;
Assignees:
Nihon Handa Co., Ltd., , JP;
Fuji Electric Co., Ltd., , JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 3/34 (2006.01); B23K 35/02 (2006.01); B23K 35/26 (2006.01); C22C 12/00 (2006.01); H01L 23/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 35/264 (2013.01); B23K 1/0016 (2013.01); B23K 35/025 (2013.01); B23K 35/26 (2013.01); C22C 12/00 (2013.01); H01L 24/13 (2013.01); H05K 3/3457 (2013.01); H05K 3/3463 (2013.01); H05K 3/3484 (2013.01); B23K 2101/42 (2018.08); H01L 2224/13113 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12042 (2013.01);
Abstract
An object of the invention is to provide a lead-free solder for die bonding having a high heat resistance temperature and an improved wetting property. Provided are a solder alloy for die bonding which contains 0.05% by mass to 3.0% by mass of antimony and the remainder consisting of bismuth and inevitable impurities, and a solder alloy for die bonding which contains 0.01% by mass to 2.0% by mass of germanium and the remainder consisting of bismuth and inevitable impurities.