This inventor holds 1 USPTO granted patent. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Takeo Saitou: Innovator in Solder Bump Technology
Introduction
Takeo Saitou is a notable inventor based in Mouka, Japan. He has made significant contributions to the field of electronics, particularly in the area of solder bump formation on circuit boards. His innovative approach has led to the development of a unique method that enhances the efficiency and reliability of electronic components.
Latest Patents
Takeo Saitou holds 1 patent for his invention titled "Solder bump formation on a circuit board using a transfer sheet." This patent describes a method of forming solder bumps on electrodes of a circuit board without producing bridging. The process utilizes a solder transfer sheet that does not require alignment. It involves superposing a circuit board and a solder transfer sheet with a solder layer adhered to at least one side of a supporting substrate. The method includes heating under pressure to a temperature lower than the solidus temperature of the solder to selectively perform solid phase diffusion bonding of the solder layer to electrodes, followed by peeling the transfer sheet from the circuit board. The solder layer can be in the form of a continuous solder coating or a monoparticle layer of solder particles adhered to the supporting substrate by an adhesive layer.
Career Highlights
Takeo Saitou is associated with Senju Metal Industry Co., Ltd., a company known for its advancements in soldering materials and technologies. His work has contributed to the company's reputation as a leader in the electronics manufacturing sector.
Collaborations
Throughout his career, Takeo Saitou has collaborated with notable colleagues, including Takeo Kuramoto and Kaichi Tsuruta. These collaborations have fostered innovation and development in their respective fields.
Conclusion
Takeo Saitou's contributions to solder bump technology exemplify the importance of innovation in the electronics industry. His patented method not only improves manufacturing processes but also enhances the performance of electronic devices.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile